Semiconductor Grade Polyimide (PI) Sheets & Rods
Ultra-high-purity Semiconductor Grade Polyimide (PI) sheets and rods engineered for extreme vacuum, plasma, and high-temperature wafer processing. Features 300°C+ continuous thermal stability (480°C short-term peak), ASTM E595 vacuum outgassing compliance, sub-ppm trace metal purity, and superior fluorine/oxygen plasma etch resistance. 100% void-free for precision CNC turning and milling. Request a quote for custom PI profile sizes and datasheets.
Product information
Published information supports preliminary product selection. Confirm the exact grade, dimensions, tolerances, documentation and application suitability with the quotation for your order.
Description
Semiconductor Grade Polyimide (PI) Sheets and Rods represent the ultimate performance threshold for non-melting thermoset/thermoplastic polyimide machining stock used in critical semiconductor front-end and back-end manufacturing. Formulated from ultra-pure, non-outgassing polyimide resin, this high temperature PI machining stock outperforms high-performance thermoplastics like PEEK in extreme environments requiring continuous operating thermal stability exceeding 300°C, direct plasma exposure resistance, and zero vacuum contamination.
Key Thermal, Physical & Vacuum Property Specifications:
| Physical & Engineering Parameter | Nominal Value | Test Standard |
| Material Type | Unfilled High-Purity Polyimide (PI) | Natural Chestnut Brown |
| Glass Transition Temp (𝑇𝑔) | 360°C – 400°C | DSC |
| Continuous Service Temp | 300°C – 350°C (Short peak 480°C) | UL 746B / Long-term |
| Tensile Strength | 85 – 105 MPa | ISO 527 / ASTM D638 |
| Flexural Modulus | 3.2 – 3.8 GPa | ISO 178 / ASTM D790 |
| Vacuum Outgassing (TML) | < 0.8% (TML) / < 0.05% (CVCM) | ASTM E595 Compliant |
| Ionic Metal Purity | Sub-ppm / Ultra-Pure | ICP-MS Tested |
| Flammability Rating | UL94 V-0 / 5VA | Inherent |
Semiconductor Industry Advantages & Chamber Performance:
• Fluorine & Oxygen Plasma Etch Resistance: Semiconductor grade polyimide PI profiles exhibit unmatched dimensional stability and minimal surface erosion when exposed to aggressive fluorine and oxygen plasma in reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD) chambers.
• Ultra-Low Outgassing & Sub-ppm Purity: Tested in strict accordance with ASTM E595 vacuum outgassing standards. This low outgassing PI rod stock contains virtually zero volatile condensable material (CVCM), eliminating wafer surface defectivity and chamber optical window clouding under high vacuum (10⁻⁹ Torr).
• Thermal Stability up to 480°C Peak: Where standard engineering plastics deform or soften above 260°C, polyimide PI rods and sheets retain structural stiffness, low CTE, and creep resistance at continuous processing temperatures exceeding 300°C.
• Precision CNC Machining & Thermal Annealing: Stress-relieved PI profile stock allows tight-tolerance CNC turning, milling, and drilling of complex wafer clamp rings and fine-pitch IC test sockets without internal micro-cracking or dimensional drift.
Target Semiconductor & Vacuum Applications:
Engineered specifically for cleanroom CNC machining of critical front-end and back-end tools:
• Wafer Processing & Plasma Chambers: Plasma resistant polyimide sheets and rods machined into wafer clamp rings, shadow rings, vacuum suction cups, gas distribution nozzles, and etch chamber insulators.
• Wet Bench & High-Temp Chemical Tools: High-purity fluid valves, chemical spray nozzles, and thermal isolators exposed to concentrated acids and solvents.
• IC Testing & Electronics Assembly: Fine-pitch IC test socket bodies, pick-and-place vacuum tips, wafer carrier pins, and high-temperature sensor housings.
Polyimide Sourcing & Supply Options:
• Stock Formats: Polyimide PI Sheets (thicknesses 2mm to 80mm) and Polyimide PI Rods (diameters Φ6mm to 150mm) in standard lengths or custom pre-cut blocks.
• Quality Assurance: Every batch of semiconductor grade polyimide machining stock is supplied with Material Test Reports (MTR), ICP-MS trace metal analysis reports, and Certificates of Conformance (CoC).
Searching for a reliable semiconductor grade polyimide PI profile supplier? Send us your STEP/DWG drawings, plasma environment specs, or dimensions for an immediate technical evaluation and quote within 12-24 hours.
Material overview
Understanding PI (Polyimide)
Why engineers use it
- Strong thermal stability for electrical and mechanical applications.
- Excellent insulation potential in films and precision parts.
- Low wear and low outgassing options in selected grades.
- Good dimensional control in carefully processed components.
- Available in forms suited to insulation, machining or formulation work.
Limits to consider
- “PI” is a family name, not a single universal grade.
- Moisture, processing route and fillers affect dimensions and performance.
- Some forms cannot be melt processed like ordinary thermoplastics.
- High cost requires a clearly defined performance need.
- Acceptance values must be tied to the exact product and test method.
Grades and product forms
Film grades target flexible insulation; powder and resin support formulation or molding routes; stock shapes serve machined components; graphite, PTFE or other fillers may tune wear and friction. Product form and grade must be identified explicitly in the RFQ.
Performance points to review
| Evaluation area | Why it matters | Information to provide |
|---|---|---|
| Temperature behavior | Useful performance under elevated or changing temperature | Continuous and peak temperature, cycle length and time at load |
| Mechanical response | Strength and stiffness must match the real part geometry | Load direction, stress level, impact and fatigue expectations |
| Environmental resistance | Fluids, cleaning agents and atmosphere can change service life | Chemical name, concentration, temperature and exposure time |
| Dimensional control | Tight-tolerance parts depend on both material and processing | Finished dimensions, tolerances and assembly conditions |
| Electrical or insulation needs | Electrical requirements may influence grade and thickness | Voltage, dielectric, conductivity or insulation target |
These are engineering discussion points, not guaranteed property values. Final acceptance criteria should be agreed for the selected grade, process and order.
Typical application directions
These examples show where the material may be evaluated. They do not replace a suitability review for the finished component.
Fabrication and processing preparation
Share the finished part drawing as well as the requested rod diameter and length. This makes it possible to discuss machining allowance, tolerance, cut length, quantity and whether a closer starting size could reduce waste.
Where the application is critical, define what a successful trial looks like before material is ordered: dimensions after processing, visual condition, mechanical response, assembly fit or another measurable result.
When another material may be better
PBI and PAI can address different extremes of heat, strength and wear, while PEEK may offer easier processing for some applications. PI is selected when its thermal, electrical or tribological balance solves the specific design problem.
We recommend sharing the current material and the reason it is being reconsidered. Cost, processability, supply form and inspection burden belong in the decision alongside technical performance.
Information needed for an accurate quotation
A useful RFQ reduces follow-up questions and helps us distinguish between a material request and a finished-part requirement.
| Product form | Raw material, stock shape, semi-finished blank or completed part |
|---|---|
| Dimensions | Nominal size, finished size and tolerances |
| Quantity | Trial quantity, first order and estimated annual demand |
| Application | Part function and current material, if any |
| Operating temperature | Continuous range, peak temperature and cycle duration |
| Environment | Chemicals, gases, moisture, pressure, vacuum or outdoor exposure |
| Mechanical duty | Load, speed, impact, wear and mating components |
| Documentation | Drawing revision, inspection, traceability or compliance needs |
Frequently asked questions
Can I request a sample or trial quantity?
Trial quantities can be discussed according to product form and availability. Tell us what you need to prove during the trial, the intended process and the expected production quantity if the test succeeds.
Do you provide a data sheet or material documentation?
Available documentation depends on the selected material and supply route. List the documents required by engineering, purchasing or quality when you inquire so they can be checked before quotation.
Can the grade be selected from a product name alone?
No. Similar product names can cover different grades, colors, fillers and processes. Selection should be based on the finished application, environment and required property balance.
Can you supply custom dimensions or finished parts?
Custom sizes, blanks or finished parts can be reviewed where appropriate. A drawing with tolerances, quantity and material requirement is the best basis for quotation.
How should we evaluate an alternative to our current material?
Share the current grade, the part’s service conditions and the reason for changing it. A useful comparison looks at failure mode, processing, life, inspection and total project cost—not only a single property value.
What determines lead time?
Lead time depends on product form, grade, size, quantity, documentation, machining and current availability. Confirm the required delivery date and destination with the RFQ rather than assuming a standard schedule.
Send the drawing, application and quantity. We will use the project details to prepare a practical material and supply discussion.
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